A few months ago, Qualcomm announced the new Snapdragon 660 and 630 mobile platforms under the 600 series. They both were the successors to the Snapdragon 653 and 626 platforms and they bring in a bunch of new upgrades like Quick charge 4 support, etc. However, now the company has announced a new mobile platform for the mid-range smartphones and tablets called the Snapdragon 450. This is the first in its tier to use 14nm FinFET process. And just like any other incremental upgrades, this one also brings in a lot of upgrades to the previous ones.
Talking about the upgrades, the Qualcomm Snapdragon 450 SoC is designed to deliver
significant improvements in battery life, graphics and compute performance, imaging and LTE
connectivity over its predecessor. The Snapdragon 435 is certainly not a bad SoC since it is one of the successful pieces of technology out there, however, the new 450 is here to take things up a notch. As mentioned earlier, this new Snapdragon 450 brings in a lot of changes over the predecessors, however, there are a few key categories where the company focused more to deliver a better experience.
The Snapdragon 450 has both CPU as well as GPU which allows for a better user experience altogether. It has an octa-core ARM Cortex A53 CPU which results in a 25-percent increase in computing performance compared to its predecessor. Also, even the integrated Qualcomm Adreno 506 GPU accounts for yet another 25-percent increase in graphics processing speeds. Qualcomm has also implemented a few power management improvements, which results in upto four additional hours of usage time compared to the predecessor. It also comes with Qualcomm® Quick Charge™ 3.0 support, which can charge a typical smartphone from zero to 80 percent in about 35 minutes.
Coming to the camera and the multimedia upgrades, Snapdragon 450 is the first in the 400-tier to support real-time Bokeh (Live Bokeh) effects. It also comes with a support for enhanced dual camera at 13+13MP or single camera support up to 21MP. The Snapdragon 450 also has support for Qualcomm® Hexagon™ DSP, which enables multimedia, camera and sensor processing at greater performance and lower power than the previous generation. In terms of the connectivity also, the company has worked out a lot of new improvements. It has the Snapdragon X9 LTE modem, which utilizes 2x20MHz Carrier Aggregation in both downlink and uplink
for peak speeds of 300 Mbps and 150 Mbps respectively. The Snapdragon 450 also supports USB 3.0 which is first in its tier to support fast USB data transfer.
As far as the availability is concerned, the Snapdragon 450 is expected to begin commercial sampling to
customers in Q3 2017, and is expected to be available in consumer devices by the end of the
year. Let us know your thoughts on this.