Recently we have read about LeEco’s financial troubles, and despite it, the company is working on an upcoming flagship model. The company also said that it would embed its upcoming with Qualcomm’s Snapdragon 835 SoC which confirms it upcoming high-end flagship model. A fresh leak shows two images of the upcoming device that have surfaced in China and are claimed to depict the upcoming handset. If the leaks are assumed to be real, then the device will come with a dual-curved display.
According to the previous reports, the upcoming device is expected to come with 6GB of RAM and 256GB of internal storage that can be further extended with MicroSD card. It is also expected to be unveiled in the month of April this year. From the new image leaks, the device will come with a USB Type-C port on the bottom and also has a speaker grill just beside it. We can also say that the device is going to b very thin and nothing much can be concluded for now.
Recent we have seen LeEco unveiled its Le Pro3 Elite smartphone which came with 5.5-inch 1080p display giving a pixel density of 401PPI. The smartphone runs Android 6.0.1 Marshmallow Operating System out of the box and there is a 4070 mAh battery on the back to power the handset. The device supports dual SIM connectivity and will be powered by a Quad-core 2.1GHz & Qualcomm Snapdragon 820 SoC coupled with Adreno 530 GPU and 4GB of RAM.
Coming to the camera front, there is a 16MP sensor on the rear which will be accompanied by a 5MP camera on the front for selfies and video calls. The onboard memory on it is limited to 32GB which can be further extended via microSD card slot. We need to wait few more days for LeEco to unveil this device and expect more leaks to shoot up in the coming days. Comment in the section below if you have any queries and stay tuned to PhoneRadar for more