From the last year, LeEco (LeTV) has been teasing the launch of its devices in the U.S market. Recently the company has scheduled a launch event on April 20th in Beijing, China where the company will be launching its latest smartphones. At the same event, we may also hear about their plans for entering the U.S market. The upcoming LeEco Le 2 is one of the smartphones that will be launched at that event.
The company is just teasing the specifications on their Weibo page without mentioning the device name. Now the device Le 2 (X620) is spotted on GFXbench revealing most of the specifications, and these are the same specs that the company is teasing on Weibo. It comes with a 5.5-inch Full HD (1920 x 1080 pixels) resolution display, and we can expect it to sport narrow bezels as seen with their previous devices.
Under the hood is the Helio X25 deca-core processor clocked at 2.0 GHz along with Mali-T880 GPU. It is the second device to feature Helio X25 processor; the Meizu has already confirmed its flagship Pro 6 to come with this same processor. It has 3GB of RAM, 32GB of internal storage, and there is no information about the MicroSD card slot. In the camera department, it sports 16MP rear camera with LED flash and autofocus that can record 4K resolution videos.
On the front, it has an 8MP selfie camera with wide-angle lens. It runs on Android 6.0 Lollipop with the highly customized eUI overlaid on top. The leaked images also confirmed the fingerprint sensor placed on the rear of the device. On the connectivity front, it supports dual SIM with 4G LTE and includes USB Type-C port. Recently, the Le Max 2 (X821) with QuadHD resolution display and Snapdragon 820 processor listed on Antutu. Unlike the Le 2, it runs on the Android 6.0.1 Marshmallow.
Featured Image: LeEco Le Max