Qualcomm’s Technology Summit took place in Maui on Tuesday, where the industry-leading chipmaker has unveiled its next-gen flagship Snapdragon 855 chipset (codenamed sm8150). With its new 5G modem, the 855 SoC is most likely to power the upcoming 5G phones early next year. Samsung probably will be the first to utilize these 5G capabilities as it is expected to launch 5G-enabled Galaxy S10 in the first half of 2019.
Apart from the 5G capabilities, the new Snapdragon 855 SoC will feature Qualcomm’s fourth-gen multi-core AI Engine. It is acclaimed to increase the AI performance by three times when compared to previous iteration chipsets. Besides, the Snapdragon 855 possess a new Qualcomm’s Computer Vision (CV) ISP that is intended to enhance the image processing capabilities by increasing computational photography and new video capture modes as well.
Another notable feature with the latest SD 855 chipset is the Qualcomm’s new 3D Sonic Sensor fingerprint technology. This tech, unlike the conventional optical and capacitive fingerprint technologies, it uses ultrasound waves to capture your fingerprint details. Unlike the alternatives, the 3D scanning would be much more secure and works along multiple layers and also without the need of any sensors, which use light, optical finger scanner, for instance.
And lastly, the SD 855 is undoubtedly designed to be a powerful SoC, which is supposed to handle high-intensive games as well. To achieve that Qualcomm had introduced new Snapdragon Elite Gaming that brings a bunch of powerful features to enhance the gaming experience on most of the powerful flagship phones, which are slated to launch with the Snapdragon 855, next year.