After the company’s hole-less smartphone crowdfunding program backfired, the back is getting back to the business with the launch of a new flagship smartphone. The upcoming Meizu 16s might launch on April 20th in China. We have already the leaked specifications and renders of the smartphone. Now, the Meizu 16s was spotted on benchmarking website Geekbench with 7nm Qualcomm Snapdragon 855 Mobile Platform and 6GB of RAM.
It also comes with Android 9.0 Pie based FlymeOS out of the box with the highly customized UI on top. The device has scored 3,778 on single core test and 10,493 on multi core test. The company also listed the Meizu 16s on its website revealing some key specifications. Firstly, we can officially confirm the device to come powered by the flagship Snapdragon 855 Mobile Platform coupled with Kryo 485 CPU and Adreno 640 GPU.
Currently, Xiaomi and Vivo are the only Chinese manufacturers to launch Snapdragon 855 powered smartphones. In the coming weeks, OPPO will be launching the OPPO Reno smartphone with Snapdragon 855 SoC and 10x lossless zoom. Talking about the Meizu 16s, the device will be coming with a 6.2-inch display. It will mostly use AMOLED panel with Full HD+ resolution. In terms of optics, the company will only offer dual camera setup on the rear featuring 48MP Sony IMX586 sensor.
From the leaked renders, we can also confirm the Meizu 16s to come with a notchless display, in-display fingerprint scanner and 10-LED ring flash. The 3C listing of the device revealed it to support up to 24W fast charging. We should be seeing more leaks about the Meizu 16s in the coming days. Stay tuned on PhoneRadar for more details!