A couple of days, we have reported about the about the TENAA listing of the LeEco Le 2 smartphone. Along with the images, we also came to know the specifications of the device which we are expecting to launch at the event scheduled on April 20th in Beijing, China. The LeEco Le 2 packs some high-end specifications and comes with all metal body.
According to the listing, the LeEco Le 2 (X621) measures 7.7 mm thickness. There are other smartphones that are much slimmer than the Le 2 like Vivo X5 Max and Oppo R5, which measures 4.75 mm and 4.85 mm thickness. Even with such a thin form factor, none of the smartphones came without the 3.5mm audio port. But at 7.7 mm thickness, the LeEco Le 2 skips the 3.5 mm audio port and features a common port that serves as charging port and audio port.
We already know that the device includes a USB Type-C port and the company might include an adapter for USB Type-C to 3.5mm audio jack or there will be a headset with USB Type-C port. The upcoming iPhone 7 is also rumored to skip the audio port that makes the device 1 mm slimmer than the current iPhone 6S and 6S Plus. But at 7.7 mm thickness, we don’t understand why LeEco planned to come with a common port.
Talking about the device specifications, it features a 5.5-inch Full HD (1920 x 1080 pixels) display with very thin bezels. It is powered by an Helio X25 deca-core processor and includes 3GB RAM and 32GB of internal storage. There is a 16MP rear camera with LED flash and an 8MP front camera for selfies. The Le 2 runs on Android 6.0 Marshmallow out-of-the-box with the customized eUI laid on top.
The device supports dual SIM dual standby and offers 4G LTE with VoLTE and other basic connectivity features. There is also a fingerprint sensor on the rear of the device which makes the Le 2 even more secure. Along with the Le 2, we also expect the company to unveil the Le 2 Pro and Le Max 2 at the April 20th event. Stay tuned for official details and pricing of the devices, since the scheduled event is less than ten days away.