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Honor Magic 2 Flagship Smartphone TENAA Listing Reveals Full Specifications



Huawei’s Honor will be launching its latest flagship smartphone next week in China. The all-new Honor Magic 2 was first teased at the IFA 2018 held last month in Berlin. The device with the model number TNY-TL00 got listed on TENAA revealing complete specifications.  As of now, the images of the device are yet to be added to the TENAA listing. However, the earlier leaked images already revealed the first look of the device.

The Honor Magic 2 sports a 6.39-inch AMOLED display with no bezels and notch. It offers Full HD+  (2340 × 1080 pixels) resolution and 19.5:9 aspect ratio. The company already confirmed to use the Kirin 980 octa-core processor clocked at 2.6GHz. The 7nm chipset also includes Mali-G76 MP10 GPU and Dual NPU. The device will be offering up to 8GB of RAM and 256GB of internal storage.

In terms of optics, the device sports triple camera setup featuring a 16MP primary sensor along with 24MP and 16MP additional sensors. The slider on the top will be equipped with a 16MP front camera along with other sensors for face unlock and 3D mapping. With the Mate 20, Huawei introduces the latest EMUI 9.0 based on Android 9.0 Pie. The upcoming Magic 2 will be first Honor smartphone to come run on the latest EMUI 9.0 out of the box.

Connectivity options include 4G LTE, Wi-Fi, Bluetooth 5, GPS, NFC, and USB Type-C port. The device is backed by a 3,400mAh non-removable battery and supports 40W wired fast charging and 15W wireless fast charging. While there is no 3.5mm audio jack on this device, the company will be providing the USB Type-C to 3.5mm audio jack adapter. It measures 157.32 × 75.13 × 8.3 mm and weighs 206 grams. Stay tuned on PhoneRadar for more details!



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