Apple is known for pushing the limits when it comes to technological innovations and we have witnessed this a lot of times before in the past. And now, we have yet another report which tells us something similar. Yes, according to the new reports which we have, it looks like Apple is working on a new technology for registering your fingerprint. The company has now filed a patent for the new under-glass acoustic fingerprint system.
It looks like Apple is planning on fitting the next generation of iPhones with a unique kind of fingerprint scanners. No, not the iPhone 7s, 7s Plus or 8, but the generation after that. Yes, it is too early to discuss this since the iPhone 9 (a possible name) is definitely more than a year away. However, the new tech which is expected to be fitted in those phones is rather interesting.
The patent reveals that this particular new sensor in question will not need a direct contact of the fingerprint, due to which the actual sensor can be placed under the glass of the display. It looks like it will need an acoustic transducer which will send piezoelectric signals to the top. The returning waves from this will be used to scan the fingerprint. Apparently, the ridges on the skin of your finger have different acoustic boundaries, which creates a unique acoustic pattern.
Well, yes, that is indeed a lot of tech to understand. However, the point is, this technology will allow the company to put the scanner underneath the glass which essentially eliminates the need to put it anywhere else on the device physically, saving space. But wait, this is just a patent and as you might have guessed it by now, it could take a lot of time for the company to make this happen. Not to forget about a ton of other limitations.
Apparently, the piezo electric components operate at higher voltages and are subject to damage with the spikes of current. It has been reported that Apple is trying to find ways to overcome this threat via a system of integrated transducer controllers. So basically, there is a lot going on here and if you want to know everything about this in detail, then we suggest you take a look at the details of this patent by heading over to the source link below.