Last year Apple decided to split the orders for A9 chip for the iPhone 6s/6s Plus between the Taiwan Semiconductor Manufacturing Company and Samsung. But according to some reports, this year the company decided to give the orders for the A10 chips for upcoming iPhone 7 solely to TSMC, taking Samsung completely out of the picture. And now according to new claims, apparently the company has decided to continue the same for the A11 chip for the next year’s iPhone 8 as well.
TSMC is believed to have a technological edge on its Korean rival, beating Samsung in the race to develop 10-nanometer processes. Also, Apple’s next-generation A11 processor that will be built on a 10nm FinFET process. As seen with various benchmark tests, the chip of the iPhone 6s/6s Plus by TSMC ran cooler than the Samsung ones and maybe this could be the reason for this switch; however, the differences were very small to notice.
Also, we heard that TSMC had finalized the initial design of the A11 chip for use in the 2017 iPhone. And with the design of the new iPhone 7 being similar to that of the iPhone 6s, the company may be planning something unique and different for a 10th-anniversary model next year. So for rounding off the changes in the new iPhone 7, we are expecting upgraded cameras, same design with no antenna bands, better storage options, a Space Black color option and removal of the headphone socket. Check out the video below to know more on that-
And as far as iPhone 8 goes, there are rumors stating that the home button will be embedded in the display. This would allow much smaller bezels. We are also expecting an all glass design with AMOLED display. We can expect these design changes as the company is planning for a 3-year recycle period. So maybe we can expect the new iPhone 8 to be a major upgrade in terms of design. However, we cannot confirm anything at this point, and we suggest you to stay tuned for more and more information on this in coming months.